Warning: Undefined array key "year" in /volume1/web/guc/php/controller/NewsSpotlight.php on line 13 創意聚焦 - GUC
日期
標題
110/10/18
GUC's Spec-in Capability Enabled 1st Silicon Success of Lidar Application
110/10/18
GUC Proprietary Interposer Design to Achieve 7.2Gbps, Enable HBM3 for Hyperscale HPC / AI / Networking SoCs
110/10/18
GUC Taped out Industry-leading 5Tbps / mm, 5nm Die-to-Die GLink 2.3 IP
110/09/20
Low Power DFT by Scan Capture Power - ICG (isolation clock gating) insertion to improve production test efficiency
110/09/20
GUC N5 HBM2E 3.6G/4G Silicon Proven
110/09/20
GLink-3D IP has been taped out in Apr'21 using TSMC 3DFabric Technology and granted by the U.S. patent in Jun'21
110/08/16
Scan Shift Power – Q Gating: Over 20% IR improvement in production
110/08/16
GUC Leads the Market to Provide CoWoS-R RDL Interposer Design Service and Verify on HBM2E 4G
110/07/19
GUC Low Voltage Re-characterization Service to Optimize the Low Power Design and SoC PPA in Early Design Phase
110/07/19
GUC Provides InFO_oS Packaging Service for AI/HPC/Networking Applications
110/06/15
GUC Spec-in Capability Enabled 1st Silicon Success and Time to Market of 5G Networking Application
110/06/15
GUC silicon-proven 5G JESD204C IP for TSMC 12nm technology have been adopted and successfully taped out in 5G leading customer's product in 1Q21
110/05/17
Early Stage IR Drop Prevention: GUC in-house Pseudo CPM (Chip Power Model) for P/G Bump Current Estimation
110/05/17
GUC 5G AFE IP silicon proven and successfully product taped out
110/04/19
GUC early adopts TSMC's most leading N3 technology, in-house design flow and IP will be completed by silicon correlation
110/03/22
GUC in-house Hyperscale Timing Model improve timing analysis efficiency for billions gate Huge Design
110/02/22
GUC's High Quality Design Capability Assures the Industry-leading 112G SerDes Product Success
110/02/22
GUC ARM Platform Solution Enables Customer's Product Success
110/02/22
Clock Mesh Methodology to Optimize High-Speed Clock Structure and Enhance Performance for HPC (High Performance Computing) Applications
110/01/18
GUC Offers Comprehensive 2.5D Package Design Service to Enable Customer's Product Success for Hyperscale Datacenter Applications
110/01/18
GUC DFT Solution for Flagship SoC: Virtual Mem Xn Mode to Reduce Testing Cycle Time
110/01/18
GUC TCAM Production Proven in 7nm and 12nm Networking ASIC