GUC Spotlight - GUC

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GUC's Spec-in Capability Enabled 1st Silicon Success of Lidar Application

GUC Proprietary Interposer Design to Achieve 7.2Gbps, Enable HBM3 for Hyperscale HPC / AI / Networking SoCs

GUC Taped out Industry-leading 5Tbps / mm, 5nm Die-to-Die GLink 2.3 IP

Low Power DFT by Scan Capture Power - ICG (isolation clock gating) insertion to improve production test efficiency

GUC N5 HBM2E 3.6G/4G Silicon Proven

GLink-3D IP has been taped out in Apr'21 using TSMC 3DFabric Technology and granted by the U.S. patent in Jun'21

Scan Shift Power – Q Gating: Over 20% IR improvement in production

GUC Leads the Market to Provide CoWoS-R RDL Interposer Design Service and Verify on HBM2E 4G

GUC Low Voltage Re-characterization Service to Optimize the Low Power Design and SoC PPA in Early Design Phase

GUC Provides InFO_oS Packaging Service for AI/HPC/Networking Applications

GUC Spec-in Capability Enabled 1st Silicon Success and Time to Market of 5G Networking Application

GUC silicon-proven 5G JESD204C IP for TSMC 12nm technology have been adopted and successfully taped out in 5G leading customer's product in 1Q21

Early Stage IR Drop Prevention: GUC in-house Pseudo CPM (Chip Power Model) for P/G Bump Current Estimation

GUC 5G AFE IP silicon proven and successfully product taped out

GUC early adopts TSMC's most leading N3 technology, in-house design flow and IP will be completed by silicon correlation

GUC in-house Hyperscale Timing Model improve timing analysis efficiency for billions gate Huge Design

GUC's High Quality Design Capability Assures the Industry-leading 112G SerDes Product Success

GUC ARM Platform Solution Enables Customer's Product Success

Clock Mesh Methodology to Optimize High-Speed Clock Structure and Enhance Performance for HPC (High Performance Computing) Applications

GUC Offers Comprehensive 2.5D Package Design Service to Enable Customer's Product Success for Hyperscale Datacenter Applications

GUC DFT Solution for Flagship SoC: Virtual Mem Xn Mode to Reduce Testing Cycle Time

GUC TCAM Production Proven in 7nm and 12nm Networking ASIC