GLink (GUC multi-die interLink) is ready for multi-die integration using InFO or CoWoS
GLink (GUC multi-die interLink) is the most optimized solution on power, area and speed for multi-die integration by InFO or CoWoS.
Total Service Package:
- Sub-system built/integration
- InFO_RDL/ Interposer design
- SI/PI/Thermal co-sim
- Sub-system bring-up services
Reliable Solution:
- No BER, error correction is not used
- DFT functionality for separate dies testing and InFO/CoWoS assembly testing
- Redundant lanes embedded to achieve better yield
Power consumption is proportional to actual transferred traffic, almost zero at no traffic.
GUC 核心優勢
- Advanced Packaging Technology Leadership
- Design Engineering Excellence
- Customer Trusted Service